Manufacturing method of LED packaging device, LED packaging device and LED display panel

The invention discloses a manufacturing method of an LED packaging device, the LED packaging device and an LED display panel. The method comprises the steps that a plurality of IC chips are arranged on the front face of a device wafer; etching a bonding material between any two adjacent interconnection electrodes in the plurality of interconnection electrodes; bonding the plurality of LED chips with the device wafer through a bonding material to form a plurality of cavity structures; filling a metal material in the plurality of cavity structures to form a plurality of interconnection structures; carrying out cutting treatment on the device wafer; forming a bonding layer on the bottom surface of the LED device, bonding the bonding layer to the substrate, and forming a bonding wire by using a wire bonding process; and packaging protection is carried out on the LED device. By manufacturing the bonding layer and forming the interconnection structure, the connection strength between the IC chip and the LED chip is