Carrier plate-like electroless tin-nickel alloy deposition method

The invention discloses a carrier-like plate electroless tin-nickel alloy deposition method, and relates to the technical field of carrier-like plate surface treatment. The invention discloses a carrier-like electroless tin-nickel alloy deposition method. The method comprises the following steps: a preimpregnation section and a deposition section are included; the electroless deposition tin-nickel alloy liquid medicine is adopted in the presoaking section, and the technological parameters of the presoaking section are as follows: the temperature is 20-35 DEG C, and the time is 2-12 minutes; the electroless tin-nickel alloy deposition liquid medicine is adopted in the deposition section, and the technological parameters of the deposition section are as follows: the temperature is 55-75 DEG C, and the time is 25-45 minutes. According to the method disclosed by the invention, the similar support plate can achieve the effect of depositing the tin-nickel alloy on the copper base only by passing through the presoak