Cutting fluid adjusting method

The invention relates to the technical field of semiconductors, in particular to a cutting fluid adjusting method which comprises the steps that silicon carbide crystals are cut through cutting fluid, and the cutting fluid comprises cutting oil and abrasive particles; detecting the viscosity eta of the cutting fluid and the distribution proportion K of the abrasive particles with the particle sizes larger than a target value in the cutting fluid; on the basis of eta and K, whether cutting oil and/or abrasive particles are added into the cutting fluid or not is determined; according to the method, the cutting cost can be reduced, meanwhile, the stable cutting capacity of the cutting fluid is guaranteed, and the problems that the cutting surface type is unstable and the cutting quality is reduced due to the fact that the cutting fluid is unstable are solved. 本发明涉及半导体技术领域，具体而言，涉及切割液调整方法，包括用切割液进行碳化硅晶体切割，切割液包括切割油和磨粒；检测切割液的粘度η和切割液中粒径大于目标值的磨粒的分布占比K；基于η和K，确定是否向切割液中添加切割油和/或磨粒；该方法能够降低切割成本，同时保证切割液稳定的切割能力，改善因切割液不稳定而导致切割面