LINKING COMPOUNDS COMPRISING AMIDE BONDS

LINKING COMPOUNDS COMPRISING AMIDE BONDS

Various embodiments provide homo-divalent linker compounds comprising the same functional group at either end, methods of making such linker compounds, and methods of using the linker compounds. 各种实施方案提供了在任一端包含相同官能团的同-二价连接基化合物、制备这种连接基化合物的方法和使用所述连接基化合物的方法。...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: BROWN JASON M, NEWMAN KEITH K. H
Format: Patent
Sprache:chi ; eng
Schlagworte:
CHEMISTRY
METALLURGY
ORGANIC CHEMISTRY
PEPTIDES
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Beschreibung
Zusammenfassung:Various embodiments provide homo-divalent linker compounds comprising the same functional group at either end, methods of making such linker compounds, and methods of using the linker compounds. 各种实施方案提供了在任一端包含相同官能团的同-二价连接基化合物、制备这种连接基化合物的方法和使用所述连接基化合物的方法。