Semiconductor structure, substrate package and method of forming semiconductor structure

The invention provides a semiconductor structure, a substrate package and a method of forming the semiconductor structure. The semiconductor structure includes a package including at least one semiconductor die, a redistribution structure, a substrate package, a plurality of solder material portions, and a second underfill material portion. The redistribution structure includes a plurality of bonding pads and a first underfill material portion between the at least one semiconductor die and the redistribution structure. The substrate package includes a plurality of chip-side bond pads and at least one substrate trench, where the at least one substrate trench extends vertically below a top surface of the substrate package in a cross-sectional view. Solder material portions are bonded to the chip-side bond pads and the bond pads. The second underfill material portion laterally surrounds the solder material portion and is distributed within the at least one substrate trench. 本公开提供一种半导体结构、基板封装及形成半导体结构的方法，包括：包括至少一半