Semiconductor packaging detection system and device based on Internet of Things technology

The invention is suitable for the technical field of semiconductor processing, and provides a semiconductor packaging test system based on the Internet of Things technology, which is composed of a temperature control module, a pressing control module, a driving control module, a liquid supply control module, a starting control module, a power supply control module, an Internet of Things gateway and a control terminal. The invention further provides a semiconductor packaging testing device based on the Internet of Things technology. The semiconductor packaging testing device comprises a base, a belt conveyor, a semiconductor packaging body, an electric pin, an electric push rod, a mounting plate, a temperature regulation and control mechanism, a testing socket, a pressing connection mechanism, a reciprocating driving mechanism, a marking nozzle, a liquid supply conveying mechanism, a trigger starting mechanism, a power supply adjusting mechanism and a limiting baffle. According to the invention, effective auto