Substrate warpage control for mounting semiconductor die

A substrate and a method of manufacturing a substrate. The substrate is adapted to mount at least one semiconductor die onto a printed circuit board. The substrate includes two opposing stacks, each stack including alternating copper layers and electrically insulating film layers. The film and copper have different coefficients of thermal expansion, allowing for control of warpage behavior of the substrate by providing substrates of different film thicknesses between opposing stacks. 一种衬底和制造衬底的方法。衬底适于将至少一个半导体管芯安装到印刷电路板上。衬底包括两个相对的堆叠，每个堆叠包括交替的铜层和电绝缘膜层。膜和铜具有不同的热膨胀系数，允许通过在相对的堆叠之间提供不同膜厚度的衬底来控制衬底的翘曲行为。