ASSEMBLY AND METHOD FOR PROCESSING WAFER

According to the invention, there is provided an assembly comprising: at least a first and a second wafer holder, each of the first and second wafer holders being capable of holding a wafer comprising a semiconductor component; a carrier selectively operable to carry one of the wafer holders to move...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: SCARPELLA MARK, DE ROMARD PHILIPPE, OBERLI MAIK, COSTE DAVID
Format: Patent
Sprache:chi ; eng
Schlagworte:
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Beschreibung
Zusammenfassung:According to the invention, there is provided an assembly comprising: at least a first and a second wafer holder, each of the first and second wafer holders being capable of holding a wafer comprising a semiconductor component; a carrier selectively operable to carry one of the wafer holders to move the wafer holder; a pick-up station, in which the pick-up station comprises means for picking up semiconductor components from the wafer on the wafer holder; a loading station, in which the loading station comprises means for loading a wafer having a semiconductor component onto the wafer holder; an intermediate shelving station including an area in which the wafer holder can be parked; a transfer device that is selectively operable to move the wafer holder from the intermediate rest station to the loading station; a controller configured to operate the carrier and the transfer device such that the carrier moves the second wafer holder from the loading station to the pick-up station at which semiconductor componen