Device for cleaning edge of wafer by using plasma

The invention provides a device for cleaning the edge of a wafer by using plasma, and the device comprises a fixing assembly which is used for bearing and fixing the passive surface of the wafer; the upper insulation assembly is located in an area on one side of the active surface of the wafer and used for protecting a core area of the active surface of the wafer, the upper insulation assembly comprises an upper insulation ring and an insulation cover plate, the upper insulation ring is located on the outer side of the insulation cover plate and connected with the insulation cover plate, the distance between the upper insulation ring and the active surface of the wafer is controllable, and the distance between the upper insulation ring and the active surface of the wafer is controllable. The upper insulating ring comprises a sealing ring, the sealing ring comprises a flexible component, and the flexible component is used for enabling the sealing ring to be in flexible contact with the active surface of the wa