Method for selectively electroplating nickel and gold

The invention discloses a method for selectively electroplating nickel and gold, which comprises the following steps: when an outer circuit is manufactured on a production board, a network to be selectively plated with gold is manufactured, and the network comprises a connection position copper surface and a PAD to be selectively plated with gold; conducting solder paste communicated with the PAD is screen-printed on the copper surface of the connection position of the production board to be used as an electroplating lead; baking the production board at a temperature lower than the melting point of the conductive solder paste so as to volatilize and remove the solvent and the metal oxide in the conductive solder paste; pasting a film on the production board, and windowing at the position corresponding to the PAD so as to expose the PAD; carrying out nickel and gold electroplating treatment on the production board so as to sequentially plate a nickel layer and a gold layer on the PAD; and finally, the film is