Copper embedding method of high-frequency copper-embedded circuit board and high-frequency copper-embedded circuit board

The invention provides a copper embedding method of a high-frequency copper-embedded circuit board and the high-frequency copper-embedded circuit board. The copper embedding method of the high-frequency copper-embedded circuit board comprises the following steps: providing a multi-layer laminated board, wherein a copper embedding groove is formed in the surface of the multi-layer laminated board; the heat dissipation mechanism is embedded in the copper embedding groove; performing tin spraying operation on the multilayer laminated plate; wherein the heat dissipation mechanism comprises a heat dissipation copper block and a plurality of elastic abutting assemblies, the elastic abutting assemblies are all connected to the heat dissipation copper block, the elastic abutting assemblies are evenly arranged in the circumferential direction of the heat dissipation copper block at intervals, one end of each elastic abutting assembly protrudes out of the outer side of the heat dissipation copper block and abuts agains