Pin header assembly with sinking table structure, prepared packaging shell and preparation method

The invention relates to the technical field of electronic packaging, in particular to a pin header assembly with a sinking table structure, a prepared packaging shell and a preparation method. Fusion sealing holes matched with the leads in number are formed in a body of the pin header assembly, eac...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: LU MING, MIAO GUANNAN, LIANG JIE, ZHU WENDING, GAO YONG, QIN HONGXIANG, WEI SIFEI
Format: Patent
Sprache:chi ; eng
Schlagworte:
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