Pin header assembly with sinking table structure, prepared packaging shell and preparation method
The invention relates to the technical field of electronic packaging, in particular to a pin header assembly with a sinking table structure, a prepared packaging shell and a preparation method. Fusion sealing holes matched with the leads in number are formed in a body of the pin header assembly, eac...
Gespeichert in:
Hauptverfasser: | , , , , , , |
---|---|
Format: | Patent |
Sprache: | chi ; eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Schreiben Sie den ersten Kommentar!