Pin header assembly with sinking table structure, prepared packaging shell and preparation method

The invention relates to the technical field of electronic packaging, in particular to a pin header assembly with a sinking table structure, a prepared packaging shell and a preparation method. Fusion sealing holes matched with the leads in number are formed in a body of the pin header assembly, eac...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: LU MING, MIAO GUANNAN, LIANG JIE, ZHU WENDING, GAO YONG, QIN HONGXIANG, WEI SIFEI
Format: Patent
Sprache:chi ; eng
Schlagworte:
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Beschreibung
Zusammenfassung:The invention relates to the technical field of electronic packaging, in particular to a pin header assembly with a sinking table structure, a prepared packaging shell and a preparation method. Fusion sealing holes matched with the leads in number are formed in a body of the pin header assembly, each lead is correspondingly fixed to the center of the corresponding fusion sealing hole through fusion sealing glass, and a sinking table structure is correspondingly arranged on the inner side of the assembly and around each fusion sealing hole. The packaging shell comprises a bottom plate and an annular frame, a window used for embedding the pin header assembly body is formed in the side wall of the annular frame, and the pin header assembly body is tightly connected with the window through welding flux. According to the invention, all the flat-head leads on the packaging are integrated by using the pin header assembly, and a sinking table stress reducing structure is adopted, so that the problems of limited integ