Component structure

The invention discloses an element structure. The structure of the element comprises a metal-insulator-metal (metal-insulator-metal; and MIM) stacking. The MIM stack includes at least a lower conductor plate layer, a first insulating layer disposed over the lower conductor plate layer, a first condu...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	CHEN DIANHAO, XIAO YUANYANG, HUANG ZHENQIU, TU WENQIONG, SHEN XIANGGU, HSIAO TSUNGIEH
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!