Method for cleaning wafer and method for manufacturing integrated circuit

The invention relates to a method for cleaning a wafer and a method for manufacturing an integrated circuit. The method for cleaning the wafer comprises the steps that the wafer is rotated at a first rotating speed, and the to-be-cleaned face of the wafer faces one side along the rotating axis; spraying water to the rotating center of the to-be-cleaned surface; the wafer subjected to the water spraying step is rotated at a second rotating speed, and the second rotating speed is larger than or equal to the first rotating speed; and baking the wafer that has undergone the step of rotating at the second rotational speed. The method can be used for well cleaning the wafer of which the surface is stained with particles. 本公开涉及用于清洗晶圆的方法、用于制造集成电路的方法。该用于清洗晶圆的方法包括：以第一转速转动晶圆，其中，晶圆的待清洗面沿转动轴线朝向一侧；对待清洗面的转动中心进行喷水；以第二转速转动经历过喷水步骤的晶圆，其中，第二转速大于或等于第一转速；以及烘烤经历过以第二转速转动步骤的晶圆。该方法可以实现对表面沾污有颗粒的晶圆进行良好的清理。