Epoxy resin composition and application thereof

The invention provides an epoxy resin composition and application thereof. The epoxy resin composition comprises a component A which is epoxy resin and a component B which is a curing agent. Wherein the curing agent comprises an aliphatic amine curing agent and a polyether amine curing agent, and th...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	CHAI RUKUAN, LI JINGPENG, LIU YUETIAN, WANG JINGRU, GUO XUE, XUE LIANG
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES ADVERTISING APPLIANCES FOR TEACHING, OR COMMUNICATING WITH, THE BLIND,DEAF OR MUTE CHEMISTRY COMPOSITIONS BASED THEREON CRYPTOGRAPHY DIAGRAMS DISPLAY DYES EDUCATION EDUCATIONAL OR DEMONSTRATION APPLIANCES GLOBES MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PHYSICS PLANETARIA POLISHES SEALS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	The invention provides an epoxy resin composition and application thereof. The epoxy resin composition comprises a component A which is epoxy resin and a component B which is a curing agent. Wherein the curing agent comprises an aliphatic amine curing agent and a polyether amine curing agent, and the mass ratio of the polyether amine curing agent to the aliphatic amine curing agent is (28-68): (1-5). The polyether amine curing agent and the aliphatic amine curing agent in a specific proportion are matched for use, and the curing speed and the curing quality of the polyether amine curing agent can be improved by utilizing the characteristic that the aliphatic amine curing agent releases heat in a curing reaction. The prepared epoxy resin adhesive is good in transparency, relatively low in curing temperature, short in curing time, good in toughness, certain in mechanical strength and relatively large in adhesive preparation amount, and can meet the requirements of physical model encapsulation for simulating und