Glue breaking method and device for glue needle for packaging semiconductor chip

The invention discloses a glue breaking method and device for a glue pin for semiconductor chip packaging, and the method comprises the steps: enabling the glue pin to leave a substrate, vertically move upwards for a first distance, and pause for a first time; and the plastic pin vertically moves upwards by a second distance again and pauses for a second time. The glue needle glue breaking device for semiconductor conductor chip packaging comprises a glue tube; the glue is positioned in the glue pipe; the glue needle is positioned at one end of the glue tube and is used for controlling the outflow of the glue; and the control module is used for controlling the glue needle to realize at least two times of vertical upward movement and two times of pause after glue dispensing is completed. According to the plastic pin breaking method for semiconductor chip packaging, the spin coating process of the plastic pin can be improved, the error rate during semiconductor chip packaging is reduced, the product percent of