Manufacturing method of PCB high-definition characters

The invention discloses a manufacturing method of PCB high-definition characters, and relates to the technical field of PCB character manufacturing. The manufacturing method comprises the following steps: S1, solder resist screen printing; s2, resistance welding and pre-baking; s3, solder resist exp...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: LIANG DONGBING, ZHANG DAOBIN
Format: Patent
Sprache:chi ; eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:The invention discloses a manufacturing method of PCB high-definition characters, and relates to the technical field of PCB character manufacturing. The manufacturing method comprises the following steps: S1, solder resist screen printing; s2, resistance welding and pre-baking; s3, solder resist exposure: setting a character reservation area and a circuit patch area on the production board, and performing solder resist exposure on positions outside the character reservation area and the circuit patch area, so that solder resist ink outside the character reservation area and the circuit patch area is exposed and cured; s4, solder mask development; s5, carrying out character screen printing; s6, character pre-baking; s7, character exposure: performing character exposure on the position of the character reservation area so that the character ink in the character reservation area is exposed and cured; and S8, character development. According to the method, the uniformity and definition of the character thickness