Packaging structure and heat dissipation method of image sensor

The invention discloses a packaging structure of an image sensor and a heat dissipation method, the packaging structure comprises a packaging shell, the packaging shell is provided with an accommodating cavity, and the accommodating cavity is used for accommodating an image sensor chip, a thermoelec...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	ZHUANG TIANYA
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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