Packaging structure and heat dissipation method of image sensor
The invention discloses a packaging structure of an image sensor and a heat dissipation method, the packaging structure comprises a packaging shell, the packaging shell is provided with an accommodating cavity, and the accommodating cavity is used for accommodating an image sensor chip, a thermoelec...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention discloses a packaging structure of an image sensor and a heat dissipation method, the packaging structure comprises a packaging shell, the packaging shell is provided with an accommodating cavity, and the accommodating cavity is used for accommodating an image sensor chip, a thermoelectric refrigeration device, a substrate and a heat dissipation pipe; the image sensor chip is connected with the substrate, the cold end of the thermoelectric refrigeration device is connected with the image sensor chip so as to absorb heat generated by the image sensor chip, the hot end of the thermoelectric refrigeration device is in contact with the heat dissipation pipe so as to conduct the heat to the heat dissipation pipe, and the heat dissipation pipe is a channel used for transmitting a heat dissipation medium; the light-transmitting cover plate covers the opening part of the packaging shell in a sealing manner, and a gap with a set width is reserved between the light-transmitting cover plate and the image s |
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