Method for verifying reliability of semiconductor laser chip
The invention relates to the technical field of semiconductor laser chip aging test, and discloses a semiconductor laser chip reliability verification method comprising the following steps: carrying out series connection test on a pulse driving circuit and a preset number of semiconductor laser chip...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention relates to the technical field of semiconductor laser chip aging test, and discloses a semiconductor laser chip reliability verification method comprising the following steps: carrying out series connection test on a pulse driving circuit and a preset number of semiconductor laser chips; and simultaneously driving a preset number of semiconductor laser chips through the pulse driving circuit, and controlling the actual output light pulse width of each semiconductor laser chip so as to verify the reliability of the semiconductor laser chips. According to the invention, the optical pulse width of the semiconductor laser chip and the actual temperature of the active area of the chip are improved, the duty ratio acceleration and the temperature acceleration are realized, and the aging time and the equipment investment cost are saved.
本发明涉及半导体激光芯片老化测试技术领域,公开了一种半导体激光芯片的可靠性验证方法,包括:将脉冲驱动电路以及预设数量的半导体激光芯片进行串联测试;通过所述脉冲驱动电路对预设数量的所述半导体激光芯片进行同时驱动,并控制每个所述半导体激光芯片的实际输出光脉冲宽度,以对所述半导体激光芯片的可靠性进行验证。本发明提高了半导体激光芯片的光脉冲宽 |
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