BALL MOUNTING METHOD AND BALL MOUNTING DEVICE

A ball mounting method for mounting a conductive ball on a predetermined electrode of a wafer (substrate). The method has a flux printing step (step S1 to step S4) in which flux is printed on an electrode by an offset gravure printing method. The method has a bead mounting step in which beads are mo...

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Bibliographische Detailangaben
Hauptverfasser:	TAMAMOTO HIDEO, YAMAGISHI AKITAKA, IWATA HIDEKI, KOBAYASHI DAISUKE, UENO TAKESHI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	A ball mounting method for mounting a conductive ball on a predetermined electrode of a wafer (substrate). The method has a flux printing step (step S1 to step S4) in which flux is printed on an electrode by an offset gravure printing method. The method has a bead mounting step in which beads are mounted on a flux (steps S5-S8). The invention provides a ball mounting method capable of realizing high-precision ball mounting. 一种将导电性的球珠搭载在晶片(基板)的规定的电极上的球珠搭载方法。具有通过凹版胶印法将助焊剂印刷在电极上的助焊剂印刷工序(步骤S1～步骤S4)。具有将球珠搭载在助焊剂上的球珠搭载工序(步骤S5～S8)。可以提供能够实现高精细的球珠的搭载的球珠搭载方法。