Printed circuit board, power semiconductor module arrangement structure including printed circuit board, and method of assembling same

Disclosed herein are a printed circuit board, a power semiconductor module arrangement including the same, and a method of assembling the same. The printed circuit board includes: a dielectric insulating layer (820) having a top side facing a first side and a bottom side opposite the first side facing a second side of the dielectric insulating layer (820); at least one conductive trace (822) formed on the dielectric insulating layer (820); and one or more conductor rails (330, 332, 334, 336) wherein each of the one or more conductor rails (330, 332, 334, 336) is mechanically coupled to the dielectric insulating layer (820), and a first portion of each of the one or more conductor rails (330, 332, 334, 336) is arranged on the first side, and a second portion of each of the one or more conductor rails (330, 332, 334, 336) is arranged on the second side. And a second portion of each of the one or more conductor rails (330, 332, 334, 336) is arranged on a second side of the dielectric insulating layer (820). 本文公开