SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

Provided are a semiconductor device and a method for manufacturing the same in which insulation failure between electrode terminals does not occur in a bent portion of the electrode terminals and the strength of the bent portion is obtained. A semiconductor device (101) is provided with: a sealing resin (2) that seals a semiconductor element therein; and a plurality of electrode terminals (3) having a root portion (4) which is a root end protruding from the sealing resin, a tip portion (6) which is a front end extending from the root portion, and an intermediate portion (5) between the tip portion and the root portion, the electrode terminals being provided so as to be aligned in a first direction, and protruding from the sealing resin in a second direction orthogonal to the first direction. The intermediate section has first intermediate sections (5A) and (5B), the widths of which in the first direction are larger than those of the root section and the tip section, and a second intermediate section (5C), the