Wafer detection device, mechanical arm and wafer monitoring method
The invention provides a wafer detection device, a mechanical arm and a wafer monitoring method.The wafer monitoring device comprises at least two sensors, each supporting arm part is correspondingly provided with one sensor, and each sensor comprises a light emitting end and a light receiving end;...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention provides a wafer detection device, a mechanical arm and a wafer monitoring method.The wafer monitoring device comprises at least two sensors, each supporting arm part is correspondingly provided with one sensor, and each sensor comprises a light emitting end and a light receiving end; light beams emitted by the light emitting end can directly irradiate the sensing area or can be reflected to the sensing area by the wafer, and the light receiving end is configured to be capable of generating corresponding sensing signals according to light parameters received by the light sensing area; and the processor is connected with the light receiving end and is used for determining the current pose information of the wafer according to the sensing signals fed back by the at least two sensors, and the current pose information of the wafer comprises at least one of the following items: wafer position offset information and wafer size information. According to the wafer detection device, the mechanical arm an |
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