Multi-chip arrangement packaging structure and method

The invention relates to a multi-chip arrangement packaging structure and method. The method comprises the following steps: providing a copper plate; planting a plurality of copper columns on the provided copper plate; a substrate is provided, and the copper columns are connected to the substrate; performing plastic package on the copper columns between the substrate and the copper plate to form a plastic package layer wrapping the copper columns; removing the copper plate by using a grinding process to expose the copper column; providing a plurality of chips, and mounting the provided chips on the copper columns; dispensing heat dissipation glue on the chip to form a heat dissipation glue layer; coating insulating glue on the side part of the chip to form an insulating glue layer which is positioned on the corresponding plastic packaging layer and is attached to the chip; and solder balls are planted on the back surface of the substrate, so that packaging is completed. According to the packaging method, a pl