SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME
A semiconductor device and a method of forming the same. The method of forming a semiconductor device includes forming a source/drain region on a substrate; forming a first interlayer dielectric on the source/drain region; forming a gate structure on the substrate and laterally adjacent to the sourc...
Gespeichert in:
Hauptverfasser: | , , , , , |
---|---|
Format: | Patent |
Sprache: | chi ; eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | A semiconductor device and a method of forming the same. The method of forming a semiconductor device includes forming a source/drain region on a substrate; forming a first interlayer dielectric on the source/drain region; forming a gate structure on the substrate and laterally adjacent to the source/drain region; and forming a gate mask on the gate structure, and forming the gate mask including: etching a portion of the gate structure to form a recess relative to a top surface of the first interlayer dielectric; depositing a first dielectric layer on the recessed gate structure and the first interlayer dielectric; etching a portion of the first dielectric layer; depositing a semiconductor layer on the recessed first dielectric layer; and planarizing the semiconductor layer so as to coplane the first interlayer dielectric. In another example, the method further includes forming a gate spacer on the substrate, etching a portion of the gate structure further including etching the portion of the gate spacer.
一种半 |
---|