SEMICONDUCTOR PACKAGE DEVICE

The invention relates to a semiconductor packaging device. The semiconductor package device includes: a first substrate; the second substrate is arranged on the first substrate; the first chip is arranged on the second substrate; and the flexible carrier plate is electrically connected with the firs...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	PAN BAIZHI, DING JUNYAN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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