SEMICONDUCTOR PACKAGE DEVICE

The invention relates to a semiconductor packaging device. The semiconductor package device includes: a first substrate; the second substrate is arranged on the first substrate; the first chip is arranged on the second substrate; and the flexible carrier plate is electrically connected with the first substrate, the second substrate and the first chip respectively. According to the semiconductor packaging device, electric connection between the first substrate and the first chip is achieved through the flexible carrier plate, no connecting wire is needed for electric connection, it is avoided that the longitudinal size of the semiconductor packaging device is additionally increased by the wire arc part of the connecting wire, and the size of the semiconductor packaging device is reduced. 本公开涉及半导体封装装置。该半导体封装装置包括：第一基板；第二基板，设置在第一基板上；第一芯片，设置在第二基板上；软性载板，分别与第一基板、第二基板和第一芯片电连接。该半导体封装装置利用软性载板实现第一基板和第一芯片之间的电连接，无需采用连接线进行电连接，避免了连接线的线弧部分额外增加半导体封装装置的纵向尺寸，有利于减小半导体封装装置的尺寸。