Automatic wafer feeding and discharging mechanism of plasma etching machine
The invention discloses an automatic wafer feeding and discharging mechanism of a plasma etching machine, which comprises a base, a stand column, a sliding block platform, an upper platform sheet, an upper cover, a guide rail, a screw rod, a wafer box baffle sheet and a stepping motor, the stand col...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention discloses an automatic wafer feeding and discharging mechanism of a plasma etching machine, which comprises a base, a stand column, a sliding block platform, an upper platform sheet, an upper cover, a guide rail, a screw rod, a wafer box baffle sheet and a stepping motor, the stand column is connected above the base through a stud, the upper cover is arranged above the stand column, a sensor mounting plate is arranged on one side of the stand column through an isolation column, and the sensor mounting plate is arranged on the other side of the stand column. A plurality of sensors are arranged on the sensor mounting plate; a sliding block platform is arranged above the lead screw, a descending shifting piece and a photoelectric switch blocking piece are arranged on the sliding block platform, upper platform pieces are arranged on the two sides of the sliding block platform, and wafer box adjusting blocking pieces and wafer box blocking piece screws which are used for fixing wafer boxes are arrang |
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