Process fluid and current distribution system for electrolytic surface treatment of substrates
The invention relates to a system (1) for distributing a process fluid (18) and an electric current for the electrolytic surface treatment of a substrate (9), comprising a distributor body (2) comprising a plurality of openings (4) for the process fluid (18) and the electric current, said plurality...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention relates to a system (1) for distributing a process fluid (18) and an electric current for the electrolytic surface treatment of a substrate (9), comprising a distributor body (2) comprising a plurality of openings (4) for the process fluid (18) and the electric current, said plurality of openings (4) being provided on a front face (10) of the distributor body (2), said front face (10) facing the main cathode (30), the invention relates to a device (1) for treating a substrate (9) to be treated, comprising a primary cathode (30) and a secondary cathode (3) adapted to draw an electrical current and to direct the electrical current to the substrate (9) to be treated, the secondary cathode (3) comprising a plurality of cathode pixels (13) distributed in an array so as to be aligned with at least one region of the substrate (9) to be treated. The plurality of cathode pixels (13) are individually controlled to adjust the current distribution on the substrate (9). The invention also relates to a dispen |
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