LED device and LED packaging method

The invention relates to the technical field of LED manufacturing, and provides an LED device and an LED packaging method, and the LED device comprises a support which comprises a substrate which is provided with a front surface and a back surface which are opposite to each other; an LED chip, wherein the LED chip is fixed on the front surface of the substrate; the light-transmitting part is arranged on the front surface of the substrate and covers the LED chips; and the fluorescent substance is arranged on the bracket or/and the light-transmitting piece, and the fluorescent substance is used for generating fluorescent reaction to generate visible light when the light emitted by the LED chip is irradiated. When the LED chip works, the fluorescent substance can generate visible light, so that the working state of the LED device can be conveniently detected. 本发明涉及LED制造技术领域，提供了一种LED器件及LED封装方法，所述一种LED器件包括：支架，包括基板，所述基板具有相对的正面和背面；LED芯片，所述LED芯片固定于所述基板的正面；透光件，所述透光件设置于所述基板的正面且覆盖所述LED芯片；荧光物质，所述荧光物质设于所述支架或/和所述透光件，所述荧光物质