Heat exchange unit and heat exchange array structure

The invention discloses a heat exchange unit, namely a heat exchange unit of a heat exchange array structure. The heat exchange unit comprises a heat exchange base, a heat insulation frame and a memory locking piece. When the temperature of the heat exchange base rises, the memory locking piece abso...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: WANG ZUANKAI, TANG KAIRUI, JIANG NINGHUA, TANG YONG, ZOU YANG, GUO GUIQING
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The invention discloses a heat exchange unit, namely a heat exchange unit of a heat exchange array structure. The heat exchange unit comprises a heat exchange base, a heat insulation frame and a memory locking piece. When the temperature of the heat exchange base rises, the memory locking piece absorbs heat, the temperature rises, the memory locking piece is in the stretching state, and the memory locking piece is separated from the heat insulation frame, so that natural or forced convection heat exchange is conducted between the heat exchange base and the outside, the temperature of the heat exchange base is lowered, and then the temperature of the electronic device is lowered. When the external temperature is low, the temperature of the memory locking piece is reduced after the memory locking piece releases heat, the memory locking piece is in a bent state, the memory locking piece and the heat insulation frame are mutually buckled at the moment, heat isolation is conducted on the heat exchange base and the