Injection mold base with good heat dissipation performance and heat dissipation method thereof
The invention provides an injection mold base with good heat dissipation performance and a heat dissipation method thereof.The injection mold base comprises a male mold plate and a female mold plate, the male mold plate and the female mold plate are connected through a guide column, an upper fixing...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention provides an injection mold base with good heat dissipation performance and a heat dissipation method thereof.The injection mold base comprises a male mold plate and a female mold plate, the male mold plate and the female mold plate are connected through a guide column, an upper fixing plate is arranged on the female mold plate, the female mold plate comprises a fixing frame and a movable plate with a mold cavity, the movable plate is embedded in the fixing frame, and the movable plate is provided with a heat dissipation hole. A demolding ejector pin pointing to the cavity is arranged in the movable plate; a first injection molding channel and a second injection molding channel which are connected with each other are respectively arranged in the upper fixed plate and the movable plate; the upper fixed plate is provided with a push plate, an ejector rod of the push plate penetrates through the upper fixed plate and is in contact with the movable plate, the male mold plate comprises a sinking plate |
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