Gap filling method, device, equipment and medium

The invention discloses a gap filling method, device and equipment and a medium, relates to the technical field of gap filling, and aims to enable a gap to be filled with filler to the greatest extent. Due to the fact that the filler can be evenly sprayed on the whole PCB substrate, and after the filler is sprayed on the substrate attached to the lamp beads on the PCB substrate, the filler can directly slide into the gaps around the lamp beads and cannot be attached to the substrate, it can be guaranteed that the filler is not attached to the upper portions of the lamp beads, and the effect that the filler is not attached to the upper portions of the lamp beads is achieved. And the gap can be filled to the greatest extent. 本申请公开了一种间隙填充方法、装置、设备及介质，涉及间隙填充技术领域，用以最大程度地使间隙可以被填充物填满。由于本申请可以在整个PCB基板上均匀喷涂填充物，且填充物在喷涂到PCB基板上的灯珠上附着的衬底上之后，会直接滑落到灯珠四周的间隙中，而并不会附着在衬底上，从而既可以保证灯珠上方不附着有填充物，又可以使得间隙可以被最大程度地填满。