Polyimide precursor composition, polyimide film, and polyimide film/substrate laminate

Provided is a polyimide precursor composition with which it is possible to produce a polyimide film having excellent thermal characteristics and/or heat resistance and also having excellent transparency. The polyimide precursor composition contains: a polyimide precursor in which repeating units com...

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Bibliographische Detailangaben
Hauptverfasser: OKA TAKUYA, SAKAI TOSHIHITO, KOHAMA YUKINORI
Format: Patent
Sprache:chi ; eng
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Zusammenfassung:Provided is a polyimide precursor composition with which it is possible to produce a polyimide film having excellent thermal characteristics and/or heat resistance and also having excellent transparency. The polyimide precursor composition contains: a polyimide precursor in which repeating units comprise a repeating unit represented by general formula (I) and a repeating unit in which general formula (I) is further imidized, and which has an imidization rate of more than 0% and less than 50%; and a solvent. (In general formula I, 70 mol% or more of X1 is a structure represented by formula (1-1), and 70 mol% or more of Y1 is a structure represented by formula (D-1) and/or (D-2). ) 提供一种能够制造热特性和/或耐热性优异且透明性也优异的聚酰亚胺膜的聚酰亚胺前体组合物。聚酰亚胺前体组合物含有:聚酰亚胺前体,其中,重复单元由下述通式(I)所示的重复单元和通式(I)被进一步酰亚胺化的重复单元构成,酰亚胺化率超过0%且小于50%;以及溶剂。(通式I中,X1的70摩尔%以上为式(1-1):所示的结构,Y1的70摩尔%以上为式(D-1)和/或(D-2)所示的结构。)