Universal planar array patch packaging mold and tube shell positioning and adjusting method

The invention provides a universal planar array patch packaging mold and a tube shell positioning and adjusting method, and belongs to the technical field of semiconductor devices.The universal planar array patch packaging mold comprises a carrier plate, a sliding plate and a sliding driving assembly, and the carrier plate is provided with a plurality of positioning grooves distributed in a rectangular array; the sliding plate is provided with at least one connecting arm and suspension arms corresponding to the positioning grooves, the suspension arms are fixedly provided with stopping plates, the stopping plates are located above the positioning grooves, and the connecting arms are located between the two adjacent rows or columns of positioning grooves; the sliding driving assembly is arranged between the sliding plate and the carrying plate and used for pushing the sliding plate to reciprocate along the positioning grooves formed in the array mode, and the positioning intervals of the positioning grooves ar