COMPONENT CARRIER WITH ASYMMETRIC STACK AND METHOD OF DETERMINING AND MANUFACTURING THE SAME
A component carrier having an asymmetric stack is described, the component carrier comprising: (a) a core; (b) a first stack at the first major surface of the core, the first stack comprising at least one first electrically conductive layer structure and a plurality of first electrically insulating...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | A component carrier having an asymmetric stack is described, the component carrier comprising: (a) a core; (b) a first stack at the first major surface of the core, the first stack comprising at least one first electrically conductive layer structure and a plurality of first electrically insulating layer structures; and (c) a second stack at the second major surface of the core, the second stack comprising at least one second electrically conductive layer structure and a plurality of second electrically insulating layer structures. At least two of the second electrically insulating layer structures are in direct contact with each other and at least one of the first electrically insulating layer structures is in contact with the second electrically insulating layer structures. Each of the at least two second electrically insulating layer structures has a smaller thickness and/or includes different material characteristics. A method for determining the design of such an asymmetric component carrier and a method |
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