Optical assembly for non-airtight packaging and sealing method

The invention relates to the technical field of semiconductor optical component packaging processes, and provides an optical component for non-airtight packaging and a sealing method. A chip array is attached to a transition block, gold wire bonding is carried out on the chip array and the transitio...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	YU BING, ZENG BIJIAN, WAN FENG, YU KAI, FANG NA, XIONG YONGHUA, CHEN LINGLING, YU JIE
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DEVICES USING STIMULATED EMISSION DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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