Optical assembly for non-airtight packaging and sealing method

The invention relates to the technical field of semiconductor optical component packaging processes, and provides an optical component for non-airtight packaging and a sealing method. A chip array is attached to a transition block, gold wire bonding is carried out on the chip array and the transition block respectively, and after bonding is completed, passive film growth and water vapor protection are carried out on the device by using an atomic deposition technology. The prepared optical component semi-finished product is subjected to waterproof treatment through the ALD growth passivation film, due to the growth characteristics of the ALD technology, the film can perform all-around passivation protection on all materials in the device, and non-airtight packaging of the component is achieved. 本发明涉及半导体光组件封装工艺技术领域，提供了一种用于非气密封装的光组件及密封方法。其芯片阵列贴于过渡块上，并且对其分别进行金丝键合，键合完成之后，利用原子沉积技术对该器件进行钝化膜生长，进行水汽保护。本发明将制备之后的光组件半成品通过ALD生长钝化膜进行防水处理，由于ALD技术的生长特点，该薄膜能够对器件中所有的材料，进行全方位的钝化保护，实现组件的非气密封装。