Adhesive suitable for HDI copper-clad plate as well as preparation method and application of adhesive

The invention relates to an adhesive suitable for an HDI copper-clad plate and a preparation method of the adhesive. The adhesive comprises the following components in parts by weight: 10-30 parts of novolac epoxy resin, 20-50 parts of polyfunctional epoxy resin, 20-50 parts of benzoxazine resin, 10...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	SU JUNHUA, LIN LICHENG, BAO XINYANG, TONG LEI, XI KUIDONG, SUN QIHUI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON DYES ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PERFORMING OPERATIONS POLISHES PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF MATERIALS AS ADHESIVES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	The invention relates to an adhesive suitable for an HDI copper-clad plate and a preparation method of the adhesive. The adhesive comprises the following components in parts by weight: 10-30 parts of novolac epoxy resin, 20-50 parts of polyfunctional epoxy resin, 20-50 parts of benzoxazine resin, 10-30 parts of a phosphorus-containing curing agent, 0.001-1 part of an imidazole accelerant, 60-150 parts of inorganic filler and 20-80 parts of an organic solvent. The Tg of the epoxy glass cloth-based copper-clad plate prepared by adopting the adhesive disclosed by the invention is more than 160 DEG C (DSC); the Z-axis CTE is less than 3.0%; in terms of heat resistance, TD is greater than or equal to 380 DEG C, and T288 is greater than 60 minutes; the peel strength (1OZ) of the copper foil is greater than 1.2 N/mm; in addition, the copper-clad plate has very low water absorption and good machining performance and dimensional stability, the flame retardance reaches the UL94V-0 level, and the prepared copper-clad pl