High-performance polyimide flexible copper-clad plate and preparation method thereof

According to the high-performance polyimide flexible copper-clad plate and the preparation method thereof, a dibenzofuran structure is introduced into a main chain of polyimide, lone pair electrons on oxygen atoms are utilized in the structure, so that the polyimide flexible copper-clad plate has good affinity with metal and has good bonding performance with metal copper; the peel strength of the polyimide layer of the prepared flexible copper-clad plate and the copper plate is as high as 0.76 N/cm. Meanwhile, due to the fact that the dibenzofuran structure has high planarity and high rigidity, and polyimide has high thermal stability (450-480 DEG C) and a low thermal expansion coefficient (18-23 ppm/K) similar to that of copper, the prepared flexible copper-clad plate can meet the requirement for high tin soldering bath temperature (350 DEG C), does not curl and has important practical application value. 本发明公开一种高性能聚酰亚胺挠性覆铜板及其制备方法，其在聚酰亚胺的主链中引入二苯并呋喃结构，其结构中利用氧原子上的孤对电子使其与金属有良好的亲和性，与金属铜具有良好的粘结性能，所制备挠性覆铜板的聚酰亚胺层与铜板