Silicon piezoresistive pressure sensor packaging structure and packaging method

The invention discloses a silicon piezoresistive pressure sensor packaging structure and packaging method.The silicon piezoresistive pressure sensor chip is fixed to a wiring base through mucilage glue, and an input electrode and an output electrode of the silicon piezoresistive pressure sensor chip are in electric signal connection with a lead column through a bonding lead; the parylene film covers and wraps the silicon piezoresistive pressure sensor chip and the bonding wire through a chemical vapor deposition method, so that the effects of isolating a medium and protecting the pressure sensor chip and the bonding wire are achieved. The packaging structure can effectively reduce the packaging volume and reduce the packaging difficulty, and because the chemical vapor deposition method has the characteristic of deposition of multiple sensors in the same batch, large-batch parallel processing can be carried out, and the packaging cost of the silicon piezoresistive pressure sensor is effectively reduced. 本发明公开了