Novel electroplated chip appearance defect detection equipment and detection method thereof
The invention relates to the technical field of electroplated chip appearance detection, in particular to novel electroplated chip appearance defect detection equipment and a detection method thereof. The device comprises a device body, and a feeding device, a detecting device, a marking device and...
Gespeichert in:
Hauptverfasser: | , , , |
---|---|
Format: | Patent |
Sprache: | chi ; eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
container_end_page | |
---|---|
container_issue | |
container_start_page | |
container_title | |
container_volume | |
creator | YANG JEONG-NAM WANG MENGZHE LAI MIANLI LI ENQUAN |
description | The invention relates to the technical field of electroplated chip appearance detection, in particular to novel electroplated chip appearance defect detection equipment and a detection method thereof. The device comprises a device body, and a feeding device, a detecting device, a marking device and a discharging device are sequentially arranged on the device body in the horizontal transverse direction. A discharging track used for conveying the electroplated chip strips is formed on the feeding device in the horizontal transverse direction, a detection track in butt joint with the discharging track is formed on the detection device, and a detection assembly used for conducting appearance defect detection on the electroplated chip strips is arranged on the detection track. Specifically, the electroplated chip strip is in a long strip shape and is made of a hard material; preferably, the discharging track, the detecting track, the marking track and the discharging track which are sequentially arranged in the ho |
format | Patent |
fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN116441193A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN116441193A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN116441193A3</originalsourceid><addsrcrecordid>eNqNyrEKwjAUheEuDqK-w_UBHEKL4ChFcerk5lAuyQkppMk1vfr8ZnBwdPrgP2fdPIb8RiREWC1ZIisc2TAJsQi4cLIgB1_nilamnAjP1yQzkhIn99NnaMiONKAg-22z8hwX7L5umv31cu9vB0gesQhbJOjYD8Ycu86YU3tu__l8ALkkPAA</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Novel electroplated chip appearance defect detection equipment and detection method thereof</title><source>esp@cenet</source><creator>YANG JEONG-NAM ; WANG MENGZHE ; LAI MIANLI ; LI ENQUAN</creator><creatorcontrib>YANG JEONG-NAM ; WANG MENGZHE ; LAI MIANLI ; LI ENQUAN</creatorcontrib><description>The invention relates to the technical field of electroplated chip appearance detection, in particular to novel electroplated chip appearance defect detection equipment and a detection method thereof. The device comprises a device body, and a feeding device, a detecting device, a marking device and a discharging device are sequentially arranged on the device body in the horizontal transverse direction. A discharging track used for conveying the electroplated chip strips is formed on the feeding device in the horizontal transverse direction, a detection track in butt joint with the discharging track is formed on the detection device, and a detection assembly used for conducting appearance defect detection on the electroplated chip strips is arranged on the detection track. Specifically, the electroplated chip strip is in a long strip shape and is made of a hard material; preferably, the discharging track, the detecting track, the marking track and the discharging track which are sequentially arranged in the ho</description><language>chi ; eng</language><subject>INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES ; MEASURING ; PERFORMING OPERATIONS ; PHYSICS ; POSTAL SORTING ; SEPARATING SOLIDS FROM SOLIDS ; SORTING ; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTEDPIECE-MEAL, e.g. BY PICKING ; TESTING ; TRANSPORTING</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230718&DB=EPODOC&CC=CN&NR=116441193A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76318</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230718&DB=EPODOC&CC=CN&NR=116441193A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>YANG JEONG-NAM</creatorcontrib><creatorcontrib>WANG MENGZHE</creatorcontrib><creatorcontrib>LAI MIANLI</creatorcontrib><creatorcontrib>LI ENQUAN</creatorcontrib><title>Novel electroplated chip appearance defect detection equipment and detection method thereof</title><description>The invention relates to the technical field of electroplated chip appearance detection, in particular to novel electroplated chip appearance defect detection equipment and a detection method thereof. The device comprises a device body, and a feeding device, a detecting device, a marking device and a discharging device are sequentially arranged on the device body in the horizontal transverse direction. A discharging track used for conveying the electroplated chip strips is formed on the feeding device in the horizontal transverse direction, a detection track in butt joint with the discharging track is formed on the detection device, and a detection assembly used for conducting appearance defect detection on the electroplated chip strips is arranged on the detection track. Specifically, the electroplated chip strip is in a long strip shape and is made of a hard material; preferably, the discharging track, the detecting track, the marking track and the discharging track which are sequentially arranged in the ho</description><subject>INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES</subject><subject>MEASURING</subject><subject>PERFORMING OPERATIONS</subject><subject>PHYSICS</subject><subject>POSTAL SORTING</subject><subject>SEPARATING SOLIDS FROM SOLIDS</subject><subject>SORTING</subject><subject>SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTEDPIECE-MEAL, e.g. BY PICKING</subject><subject>TESTING</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNyrEKwjAUheEuDqK-w_UBHEKL4ChFcerk5lAuyQkppMk1vfr8ZnBwdPrgP2fdPIb8RiREWC1ZIisc2TAJsQi4cLIgB1_nilamnAjP1yQzkhIn99NnaMiONKAg-22z8hwX7L5umv31cu9vB0gesQhbJOjYD8Ycu86YU3tu__l8ALkkPAA</recordid><startdate>20230718</startdate><enddate>20230718</enddate><creator>YANG JEONG-NAM</creator><creator>WANG MENGZHE</creator><creator>LAI MIANLI</creator><creator>LI ENQUAN</creator><scope>EVB</scope></search><sort><creationdate>20230718</creationdate><title>Novel electroplated chip appearance defect detection equipment and detection method thereof</title><author>YANG JEONG-NAM ; WANG MENGZHE ; LAI MIANLI ; LI ENQUAN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN116441193A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2023</creationdate><topic>INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES</topic><topic>MEASURING</topic><topic>PERFORMING OPERATIONS</topic><topic>PHYSICS</topic><topic>POSTAL SORTING</topic><topic>SEPARATING SOLIDS FROM SOLIDS</topic><topic>SORTING</topic><topic>SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTEDPIECE-MEAL, e.g. BY PICKING</topic><topic>TESTING</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>YANG JEONG-NAM</creatorcontrib><creatorcontrib>WANG MENGZHE</creatorcontrib><creatorcontrib>LAI MIANLI</creatorcontrib><creatorcontrib>LI ENQUAN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>YANG JEONG-NAM</au><au>WANG MENGZHE</au><au>LAI MIANLI</au><au>LI ENQUAN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Novel electroplated chip appearance defect detection equipment and detection method thereof</title><date>2023-07-18</date><risdate>2023</risdate><abstract>The invention relates to the technical field of electroplated chip appearance detection, in particular to novel electroplated chip appearance defect detection equipment and a detection method thereof. The device comprises a device body, and a feeding device, a detecting device, a marking device and a discharging device are sequentially arranged on the device body in the horizontal transverse direction. A discharging track used for conveying the electroplated chip strips is formed on the feeding device in the horizontal transverse direction, a detection track in butt joint with the discharging track is formed on the detection device, and a detection assembly used for conducting appearance defect detection on the electroplated chip strips is arranged on the detection track. Specifically, the electroplated chip strip is in a long strip shape and is made of a hard material; preferably, the discharging track, the detecting track, the marking track and the discharging track which are sequentially arranged in the ho</abstract><oa>free_for_read</oa></addata></record> |
fulltext | fulltext_linktorsrc |
identifier | |
ispartof | |
issn | |
language | chi ; eng |
recordid | cdi_epo_espacenet_CN116441193A |
source | esp@cenet |
subjects | INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES MEASURING PERFORMING OPERATIONS PHYSICS POSTAL SORTING SEPARATING SOLIDS FROM SOLIDS SORTING SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTEDPIECE-MEAL, e.g. BY PICKING TESTING TRANSPORTING |
title | Novel electroplated chip appearance defect detection equipment and detection method thereof |
url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-10T23%3A03%3A44IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=YANG%20JEONG-NAM&rft.date=2023-07-18&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN116441193A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |