Conductive adhesive, anisotropic conductive film, connection structure, and method for producing connection structure

The invention provides a conductive adhesive which can obtain good solder wettability and conductivity. In addition, the present invention provides an anisotropic conductive film, a connection structure, and a method for manufacturing the connection structure, with which excellent solder wettability, conductivity, and insulating properties can be obtained. The anisotropic conductive film contains a thermosetting binder, solder particles, and dicarboxylic acid, the solder particles contain 50-80 wt% Sn and 20-50 wt% Bi, the amount of dicarboxylic acid blended is 1-15 parts by mass per 100 parts by mass of the thermosetting binder, the average particle diameter of the solder particles is 40-5 [mu] m, the amount of solder particles blended is 100-1200 parts by mass per 100 parts by mass of the thermosetting binder, and the average particle diameter of the solder particles is 40-50 [mu] m. The thickness of the anisotropic conductive film is greater than 110% of the average particle diameter of the solder particle