Method for producing micromechanical component for sensor or microphone device

Method for producing micromechanical component for sensor or microphone device

The invention relates to a method for producing a micromechanical component for a sensor or microphone device, comprising the following steps: forming a support structure (10) from a first sacrificial material on a substrate surface (12a) of a substrate (12), the support structure has a first sacrif...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: FRIEDRICH THOMAS, ALTMAN HEMAN, SCHMOLLNGRUBER PETER, SCHEUERLE ANDREAS, WEBER HEIKE, SCHILLER UWE
Format: Patent
Sprache:chi ; eng
Schlagworte:
MICROSTRUCTURAL TECHNOLOGY
PERFORMING OPERATIONS
PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
TRANSPORTING
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator FRIEDRICH THOMAS
ALTMAN HEMAN
SCHMOLLNGRUBER PETER
SCHEUERLE ANDREAS
WEBER HEIKE
SCHILLER UWE
description The invention relates to a method for producing a micromechanical component for a sensor or microphone device, comprising the following steps: forming a support structure (10) from a first sacrificial material on a substrate surface (12a) of a substrate (12), the support structure has a first sacrificial material layer (14), a plurality of etched holes (16) structured by the first sacrificial material layer (14) and a plurality of support pillars (18) protruding into the substrate (12), etching at least one cavity (22) spanned by the support structure (10) into the substrate surface (12a), forming a membrane (30) from at least one semiconductor material on or above the first sacrificial material layer (14) of the support structure (10), depositing a layer stack (34), the layer stack (34) comprising at least one sacrificial layer (36a, 36b) and at least one counter electrode (38), and releasing the membrane (30) by at least partially removing at least the support structure (10) and the at least one sacrificial
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN116438136A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN116438136A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN116438136A3</originalsourceid><addsrcrecordid>eNrjZPDzTS3JyE9RSMsvUigoyk8pTc7MS1fIzUwuys9NTc5IzMtMTsxRSM7PLcjPS80rAasrTs0rBlJABFZXkAGUUkhJLctMTuVhYE1LzClO5YXS3AyKbq4hzh66qQX58anFBYnJqXmpJfHOfoaGZibGFobGZo7GxKgBAGGNNyI</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Method for producing micromechanical component for sensor or microphone device</title><source>esp@cenet</source><creator>FRIEDRICH THOMAS ; ALTMAN HEMAN ; SCHMOLLNGRUBER PETER ; SCHEUERLE ANDREAS ; WEBER HEIKE ; SCHILLER UWE</creator><creatorcontrib>FRIEDRICH THOMAS ; ALTMAN HEMAN ; SCHMOLLNGRUBER PETER ; SCHEUERLE ANDREAS ; WEBER HEIKE ; SCHILLER UWE</creatorcontrib><description>The invention relates to a method for producing a micromechanical component for a sensor or microphone device, comprising the following steps: forming a support structure (10) from a first sacrificial material on a substrate surface (12a) of a substrate (12), the support structure has a first sacrificial material layer (14), a plurality of etched holes (16) structured by the first sacrificial material layer (14) and a plurality of support pillars (18) protruding into the substrate (12), etching at least one cavity (22) spanned by the support structure (10) into the substrate surface (12a), forming a membrane (30) from at least one semiconductor material on or above the first sacrificial material layer (14) of the support structure (10), depositing a layer stack (34), the layer stack (34) comprising at least one sacrificial layer (36a, 36b) and at least one counter electrode (38), and releasing the membrane (30) by at least partially removing at least the support structure (10) and the at least one sacrificial</description><language>chi ; eng</language><subject>MICROSTRUCTURAL TECHNOLOGY ; PERFORMING OPERATIONS ; PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS ; TRANSPORTING</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20230714&amp;DB=EPODOC&amp;CC=CN&amp;NR=116438136A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20230714&amp;DB=EPODOC&amp;CC=CN&amp;NR=116438136A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>FRIEDRICH THOMAS</creatorcontrib><creatorcontrib>ALTMAN HEMAN</creatorcontrib><creatorcontrib>SCHMOLLNGRUBER PETER</creatorcontrib><creatorcontrib>SCHEUERLE ANDREAS</creatorcontrib><creatorcontrib>WEBER HEIKE</creatorcontrib><creatorcontrib>SCHILLER UWE</creatorcontrib><title>Method for producing micromechanical component for sensor or microphone device</title><description>The invention relates to a method for producing a micromechanical component for a sensor or microphone device, comprising the following steps: forming a support structure (10) from a first sacrificial material on a substrate surface (12a) of a substrate (12), the support structure has a first sacrificial material layer (14), a plurality of etched holes (16) structured by the first sacrificial material layer (14) and a plurality of support pillars (18) protruding into the substrate (12), etching at least one cavity (22) spanned by the support structure (10) into the substrate surface (12a), forming a membrane (30) from at least one semiconductor material on or above the first sacrificial material layer (14) of the support structure (10), depositing a layer stack (34), the layer stack (34) comprising at least one sacrificial layer (36a, 36b) and at least one counter electrode (38), and releasing the membrane (30) by at least partially removing at least the support structure (10) and the at least one sacrificial</description><subject>MICROSTRUCTURAL TECHNOLOGY</subject><subject>PERFORMING OPERATIONS</subject><subject>PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZPDzTS3JyE9RSMsvUigoyk8pTc7MS1fIzUwuys9NTc5IzMtMTsxRSM7PLcjPS80rAasrTs0rBlJABFZXkAGUUkhJLctMTuVhYE1LzClO5YXS3AyKbq4hzh66qQX58anFBYnJqXmpJfHOfoaGZibGFobGZo7GxKgBAGGNNyI</recordid><startdate>20230714</startdate><enddate>20230714</enddate><creator>FRIEDRICH THOMAS</creator><creator>ALTMAN HEMAN</creator><creator>SCHMOLLNGRUBER PETER</creator><creator>SCHEUERLE ANDREAS</creator><creator>WEBER HEIKE</creator><creator>SCHILLER UWE</creator><scope>EVB</scope></search><sort><creationdate>20230714</creationdate><title>Method for producing micromechanical component for sensor or microphone device</title><author>FRIEDRICH THOMAS ; ALTMAN HEMAN ; SCHMOLLNGRUBER PETER ; SCHEUERLE ANDREAS ; WEBER HEIKE ; SCHILLER UWE</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN116438136A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2023</creationdate><topic>MICROSTRUCTURAL TECHNOLOGY</topic><topic>PERFORMING OPERATIONS</topic><topic>PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>FRIEDRICH THOMAS</creatorcontrib><creatorcontrib>ALTMAN HEMAN</creatorcontrib><creatorcontrib>SCHMOLLNGRUBER PETER</creatorcontrib><creatorcontrib>SCHEUERLE ANDREAS</creatorcontrib><creatorcontrib>WEBER HEIKE</creatorcontrib><creatorcontrib>SCHILLER UWE</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>FRIEDRICH THOMAS</au><au>ALTMAN HEMAN</au><au>SCHMOLLNGRUBER PETER</au><au>SCHEUERLE ANDREAS</au><au>WEBER HEIKE</au><au>SCHILLER UWE</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Method for producing micromechanical component for sensor or microphone device</title><date>2023-07-14</date><risdate>2023</risdate><abstract>The invention relates to a method for producing a micromechanical component for a sensor or microphone device, comprising the following steps: forming a support structure (10) from a first sacrificial material on a substrate surface (12a) of a substrate (12), the support structure has a first sacrificial material layer (14), a plurality of etched holes (16) structured by the first sacrificial material layer (14) and a plurality of support pillars (18) protruding into the substrate (12), etching at least one cavity (22) spanned by the support structure (10) into the substrate surface (12a), forming a membrane (30) from at least one semiconductor material on or above the first sacrificial material layer (14) of the support structure (10), depositing a layer stack (34), the layer stack (34) comprising at least one sacrificial layer (36a, 36b) and at least one counter electrode (38), and releasing the membrane (30) by at least partially removing at least the support structure (10) and the at least one sacrificial</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language chi ; eng
recordid cdi_epo_espacenet_CN116438136A
source esp@cenet
subjects MICROSTRUCTURAL TECHNOLOGY
PERFORMING OPERATIONS
PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
TRANSPORTING
title Method for producing micromechanical component for sensor or microphone device
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-04T13%3A45%3A16IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=FRIEDRICH%20THOMAS&rft.date=2023-07-14&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN116438136A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true