Method for producing micromechanical component for sensor or microphone device

The invention relates to a method for producing a micromechanical component for a sensor or microphone device, comprising the following steps: forming a support structure (10) from a first sacrificial material on a substrate surface (12a) of a substrate (12), the support structure has a first sacrificial material layer (14), a plurality of etched holes (16) structured by the first sacrificial material layer (14) and a plurality of support pillars (18) protruding into the substrate (12), etching at least one cavity (22) spanned by the support structure (10) into the substrate surface (12a), forming a membrane (30) from at least one semiconductor material on or above the first sacrificial material layer (14) of the support structure (10), depositing a layer stack (34), the layer stack (34) comprising at least one sacrificial layer (36a, 36b) and at least one counter electrode (38), and releasing the membrane (30) by at least partially removing at least the support structure (10) and the at least one sacrificial