Flattening guide wheel motor and silicon wafer cutting equipment

The invention relates to a flattened guide wheel motor and silicon wafer cutting equipment, and the flattened guide wheel motor comprises a motor housing which is provided with a containing channel in the central axis direction, and the outer side of the containing channel is provided with an annular containing groove in a surrounding manner; the driving module is arranged in the annular accommodating groove; the rotating assembly is coaxially arranged in the containing channel, and the rotating assembly is connected with the driving module; a bearing assembly is arranged between the rotating assembly and the motor shell, and the rotating assembly can rotate relative to the motor shell. Compared with the prior art, the flattened guide wheel motor is compact in internal structure, the rotating main shaft of the rotating assembly is arranged in the containing channel of the motor shell and is directly fixed to the rotor assembly, a connecting structure of a coupler is omitted, the axial size of the guide wheel