Wafer detection structure and wafer detection method

The invention discloses a wafer detection structure and a wafer detection method, and the structure is based on an etching device, and the etching device comprises an electrostatic chuck which is used for placing a wafer; the lifting assembly is used for driving the wafer to ascend; the transfer assembly is used for transferring the wafer to the electrostatic chuck or transferring the jacked wafer; the wafer detection structure comprises at least two sets of monitoring sensors arranged in the cavity, the monitoring sensors are located above the electrostatic chuck, one set of monitoring sensors is used for detecting whether the wafer is lifted in place or not, and the other monitoring sensors are used for detecting whether the lifted wafer inclines or not. According to the technical scheme, the inclination of the wafer can be found in time, and the possibility that the wafer is scratched is reduced. 本申请公开了一种晶圆侦测结构和晶圆侦测方法，其中结构基于一刻蚀设备，刻蚀设备包括：静电吸盘，静电吸盘用于放置晶圆；升降组件，用于带动晶圆上升；转移组件，用于将晶圆转移到静电吸盘上，或将被顶起的晶圆转移；晶圆侦测结构包括设置