Overlay deviation compensation method

The invention discloses an overlay deviation compensation method, and the method comprises the steps: providing to-be-compensated batch wafers which comprise a plurality of to-be-compensated wafers, and each to-be-compensated wafer is provided with a plurality of initial fin parts; according to a y-order compensation model, performing first overlay deviation compensation on the to-be-compensated wafer to form a first photoetching layer; etching a plurality of initial fin parts on the wafer to be compensated according to the first photoetching layer to form a plurality of fin parts; forming an initial first layer on the plurality of fin parts; according to a z-order compensation model, second overlay deviation compensation is carried out on the batch of wafers to be compensated, a second photoetching layer is formed, and z is larger than y; and patterning the initial first layer of the to-be-compensated wafer according to the second photoetching layer, and forming a first layer on the to-be-compensated wafer a